1. 12+ years actively involved in PWB design for high-density electronics packaging.
2. 10+ years' experience in a PWB design role designing consumer-grade mobile products or low volume test products utilizing latest generation processor chips & ICs.
3. Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools.
4. Experience with micro-vias (stacked), sequential lamination stack-ups and design rules using .5mm pitch and smaller packages
5. Experience working include working with US and India teams to provide PWB design solutions for high performance electronic assemblies for Mobile, Modem, Auto, Compute, Infrastructure and IOT