Bachelor of Science in Mechanical Engineering or related engineering field.
10+ years of experience designing mechanical packaging for electronic control and power supply assemblies.
Proficient in the use of 3D CAD software (preferably Siemens NX CAD / Unigraphics).
Proficient in simulation tools to perform stress and thermal analyses of electronic assemblies (e.g. ANSYS, Icepak, CFD).
Experience with the integration of rigid, flexible and rigi-flex printed circuit boards into mechanical assemblies.
Familiar with electrical connectors and interconnect methodologies.
Ability to travel 10% of the time.
What will your typical day look like?
Work closely with the electrical and system engineers to design and model complex electronic assemblies involving the integration of PCBs and interconnects with a mechanical enclosure and parts.
Design electronic enclosures and optimize panel architecture to meet project goals for performance, testability, manufacturability, and cost.
Research/select connector and interconnect devices based on project requirements and vendor options.
Apply industry best practices for ruggedized electronics, including but not limited to thermal management, EMC, shock and vibration.
Create finite element models to simulate load cases and predict structural, fatigue, and dynamic characteristics of new products.
Perform detailed thermal simulation of electronic assemblies to predict operating temperatures under various conditions. Conduct thermal mitigation tradeoff studies, often involving active and/or forced air cooling.
Analyze detailed mechanical assembly characteristics, such as bolted joints, tolerance stack ups, and GD&T.
Prepare and release design documentation (e.g. drawings, calculations, bills of material, and purchase specifications).
Conduct technical design reviews with internal and external customers
Support the organization with vendor selection, production launch and PPAP documentation.
Lead and execute the validation and qualification of new products, components, and assemblies, with focus on mechanical and thermal performance, and electrical functional tests.
Support multiple work assignments with shifting priorities and quickly pivot design direction as new information arises.