Job Description:
IC Packaging Mechanical Design Engineer - (New Providence, NJ)Join a growing engineering team and develop cutting-edge optical modules for high-performance computing.
Responsibilities:
- Design innovative packaging solutions for optical modules
- Develop testing procedures and ensure product reliability
- Troubleshoot technical challenges in packaging and materials
- Build and maintain component models and technical drawings
- Collaborate with internal and external teams for seamless integration
Qualifications:
- BS in Mechanical Engineering
- 2+ years of IC package design experience Or Ph.D. in Mechanical Engineering
- Excellent communication skills
Preferred Skills:
- SolidWorks (PDM) & FEA tools (ANSYS Mechanical)
- Rapid prototyping (Formlabs 3D printing a plus)
- Design for manufacturing (CNC, casting, MIM)
- Optical module reliability (Telcordia GR-468)
- Advanced IC packaging technologies (3D/2.5D IC, FOWLP, MCM FC-BGA)
- High-speed test socket and connector experience