4 - 8+ years of prior experience in semiconductor manufacturing process engineering
Bachelor's degree or higher: Chemical Engineering, Electrical Engineering, Materials Science, Solid State Physics or other relevant discipline
Plusses:
Masters or PhD degree in Materials Science, Electrical Engineering, Solid State Physics, Chemical or other relevant engineering physical science discipline is preferred
Experience at Intel, TSMC, or Micron
Experience and understanding of high-volume manufacturing
Understanding of FEOL and BEOL integration
Role Overview:
Our client is seeking a highly motivated Member of Technical Staff in process engineering to become a part of our 300mm wafer fabrication facility in Malta, New York. The individual will be responsible for process sustenance and development that includes process variability reduction, recipe development, defectivity reduction and process optimization for high volume manufacturing (HVM). Collaborate with our client's internal customers and participate in development/manufacturing of unit process for various technologies including FinFET, Si Photonics and many more. Drive continuous improvement efforts in support of throughput improvement, cost reduction, and yield learning. Interact and collaborate closely with multiple internal and external stakeholders and teams such as equipment suppliers, equipment engineers and technicians, CFM (contamination free manufacturing) team, PI (process integration) team, cost management and quality assurance teams.