You will function as a liaison between different groups, develop an understanding in materials by correlating its properties to performance and failures, address failure mechanisms and suggest possible solutions, You will also be expected to get trained on different tools, support material durability studies, develop standard operating protocols, and coordinate the use of instruments.
Key Qualifications:
Bachelor's or Master in Physics, Material Science, Mechanical Engineering or a related field.
Familiarity in detecting failures in consumer electronics.
At least 2+ years of hands-on experience in imaging techniques.
Proficient with 2D x-ray, x-ray tomography, SEM/EDS, FIB-SEM optical microscopy, and spectroscopy techniques. • Experience in sample preparation required for different techniques. • Excellent written and oral communication and presentation skills and ability to build relationships. • Capable of collecting quality data, a basic understanding to cross-correlate results from different techniques, and present interpretations focused on the outstanding issue. • Proven experience working on material characterization and fault isolation methods
Description: • Use different imaging techniques to drive root-cause analysis. • Get trained and support others to address needs from failure analysis projects • Interface with cross-functional teams • Adhere to the best-of-class lab practices. Maintain an organized and clean laboratory environment, manage sample inventory, and follow all lab health and safety regulations. • Perform failure analysis • Help driving action plans to solve complex problems. • Cross-correlate data from various techniques to drive towards conclusions. • Hands-on work with various tools including x-ray imaging, optical and electron microscopy, FIB/SEM, and thermal and spectroscopy techniques.
Must-Have Skills: • Working in Lab environment • X-ray imaging, optical and electron microscopy, FIB/SEM, thermal and spectroscopy techniques