Requirement: • Hands on experience in a lab, handling materials and tools. (Will be troubleshooting) • Experience working within a physical/chemical laboratory environment. • Hands-on experience with mechanical & chemical sample prep of microelectronics and dual beam sample analysis, including EDS; STEM/TEM; optical measurements.
Responsibilities: • Applies knowledge of failure analysis (e.g., physical/electrical failure analysis, etc.) to determine the cause of failure by assisting in the evaluation of electrical and mechanical characteristics of systems and/or integrated circuits, components, and sub-components. • Administers non-destructive testing on devices using imaging tools (e.g., X-ray, C-SAM) and/or optical inspections. • Performs failure analyses on straightforward issues (e.g., level 1) following clearly defined procedures. • Performs physical failure analyses by examining individual layers of silicon to reveal evidence of defect; addresses low-risk, systematic issues that allow analyses to be tried and tested on multiple devices.