The candidate will use Orcad and Altium PCB layout tools to design boards that meet critical design and signal integrity constraints. They will work closely with hardware design, simulation, and manufacturing engineers to define and implement PCB routing and manufacturability constraints. Additionally, they will collaborate with PCB fabrication companies to ensure impedance design targets are achieved while adhering to manufacturability constraints for high-volume production. The candidate will also be responsible for generating all engineering documentation required for PCB fabrication, including ECOs, Gerber databases, and fabrication drawings.
Education / Experience:
Detailed understanding of high-speed digital PCB routing constraints.
Thorough knowledge of multilayer PCB construction.
High Density Interconnect (HDI) and DDR4 design experience.
Familiarity with constraints-driven PCB layout methodology.
Hands-on experience with current Orcad PCB layout tools.
Experience with Rigid Flex design (a plus).
Proficient computer skills, with experience in MS Word, Excel, and Project.
Detail-oriented with a proven ability to organize, analyze, prioritize, and multitask in a fast-paced environment.
Excellent oral and written communication skills.
Bachelor of Science in Electrical Engineering (BSEE) or Bachelor of Science in Electronics Engineering Technology (BSEET).