Distinguished Engineer - Electronic Packaging Technology Leader at Medtronic in Tempe, Arizona

Job Description:

At Medtronic you can begin a life-long career of exploration and innovation, while helping champion healthcare access and equity for all. You'll lead with purpose, breaking down barriers to innovation in a more connected, compassionate world.

A Day in the Life
3D electronic packaging technology is an important enabler for future product miniaturization. It is important to have a knowledgeable technology leader to drive a strategic roadmap leveraging the best of internal and external opportunities to insure a compelling, stable, and scalable path for differentiating products for the future.

This position will have a Hybrid work schedule, being on-site 3+ days / week at the Tempe, AZ Campus.

The Distinguished Engineer - Electronic Packaging Technology Leader will work with partners to develop and execute the strategy for miniaturized electronic packaging technology at the site. 3D heterogenous integration is an emerging technology and market differentiator for miniaturization. There are many opportunities to showcase DRM, innovation, and continuous improvement for this new technology as it is applied across applications and business units as key elements for success. This position is expected to collaborate with other members of the Tempe Campus and other OUs technology, product development, and operations teams at their level as well as key leadership stakeholders in various OUs and high-volume facility leaders for successful development, integration, and commercialization of these new technologies.

3D Heterogeneous Integration technology is a combination of a number of emerging technologies and existing semiconductor technologies, but with new processes and requirements to realize new and differentiating design capabilities, and device manufacturing to enable significant competitive advantage in the marketplace. None of this is incremental product development. As such, strategy and innovation is required on all fronts in developing and enabling for design requirements, processes, equipment, methods, analysis, manufacturing flow, capacity, and compliance adherence for development and operations that span across design, reliability, and manufacturing (DRM) needs. This requires significant strategic effort on how to envision integrating the electronic system, align multiple stakeholders across adjacent technologies, develop key requirements, meet them, ensure them in manufacturing, and demonstrate integration capabilities with both development and operations partners. 3D Heterogeneous Integration has global connections and reach for both interactions with suppliers as well as down stream customers. Specific customers include OU development partners in Mounds view (CPT, DS), Brooklyn Park (MECC), Rice Creek (NM, PH) and Lafayette (Acute Care & Monitoring and Surgical Robotics), and downstream HVF partners in Singapore, Switzerland, and Puerto Rico. Supply chain interactions are varied with interactions across Asia, Europe, and the Americas.

Communications are primarily internal across reports, partners, stakeholders, and leadership including business and program leader updates due to strategic importance of this new technology. Since application of technology is proprietary, external communications are focused with our development or supply chain partners supporting commercialization efforts. Internal influencing, negotiating, and aligning is required frequently with Core team, Technology, Design, Product Development Program Management, Operations, Reliability, Sourcing, Quality Assurance, High Volume Facility functions and leaders across sites and OUs (CPT, DS, NM, PH, PM, CST, etc.).

Responsibilities at this level may include the following and other duties may be assigned.

• Designs, develops, documents, tests, maintains, and debugs applications software and systems that contain logical and mathematical solutions.


• Conducts multidisciplinary research and collaborates with equipment designers and/or hardware engineers in the planning, design, development, and utilization of electronic data processing systems for product and commercial software.


• Determines computer user needs; analyzes system capabilities to resolve problems on program intent, output requirements, input data acquisition, programming techniques and controls; prepares operating instructions; designs and develops compilers and assemblers, utility programs, and operating systems.


• Ensures software standards are met.


• Plans R&D or system projects or strategic functional initiatives and recommends technological application projects / solutions to accomplish medium-term to long-range objectives.


• Contributes to the design of new products, processes, standards, or operational plans based on business strategy with a direct impact on functional area for the business unit.


• Faces problems that are complex, requiring broad-based consideration of variables that impact multiple areas of the organization.


• Develops solutions which are novel and unique and drawing upon best practices based on expertise.


• Writes technical papers and/or patents; Fosters technical innovation.


• Expected to guide or lead business unit in new technical directions.


• Typically manages large, complex initiatives of strategic importance to the business unit, involving large cross-functional teams.

Must Have: Minimum Requirements

To be considered for this role, please ensure the minimum requirements are evident on your resume.

• Bachelor's Degree required and a minimum of 15 years of relevant experience with d eep and broad knowledge of advanced semiconductor packaging industry tools, techniques, and suppliers across organic and inorganic packaging 2.5 & 3D approaches; OR an Advanced Degree and a minimum of 13 years of relevant experience with d eep and broad knowledge of advanced semiconductor packaging industry tools, techniques, and suppliers across organic and inorganic packaging 2.5 & 3D approaches.


• Demonstrated technical leadership in advocating for, developing, and delivering new technology solutions. Viewed as the leading expert and / or resource within the field by peers within and outside the organization.

Nice to Have

• Broad industry experience and relationships with leading supply chain partners across 2.5 & 3D advanced semiconductor packaging landscape.


• Attributes highlighting industry expertise and/or recognitions such as published patents, trade secrets, papers, presentations, industry associations, conference leadership, education, references, etc.


• Experience in developing and presenting proposals at both peer and executive leadership levels for both internal and external funding opportunities, including government grant writing, landscape, and connections desirable.

Physical Job Requirements

The above statements are intended to describe the general nature and level of work being performed by employees assigned to this position, but they are not an exhaustive list of all the required responsibilities and skills of this position.

The physical demands described within the Responsibilities section of this job description are representative of those that must be met by an employee to successfully perform the essential functions of this job. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions. For Office Roles: While performing the duties of this job, the employee is regularly required to be independently mobile. The employee is also required to interact with a computer, and communicate with peers and co-workers. Contact your manager or local HR to understand the Work Conditions and Physical requirements that may be specific to each role.

Benefits & Compensation

Medtronic offers a competitive Salary and flexible Benefits Package
A commitment to our employees lives at the core of our values. We recognize their contributions. They share in the success they help to create. We offer a wide range of benefits, resources, and competitive compensation plans designed to support you at every career and life stage.

Salary ranges for U.S (excl. PR) locations (USD):$186,400.00 - $279,600.00

The base salary range is applicable across the United States, excluding Puerto Rico and specific locations in California. The offered rate complies with federal and local regulations and may vary based on factors such as experience, certification/education, market conditions, and location. Compensation and benefits information pertains solely to candidates hired within the United States (local market compensation and benefits will apply for others).

Medtronic benefits and compensation plans

About Medtronic

We lead global healthcare technology and boldly attack the most challenging health problems facing humanity by searching out and finding solutions.
Our Mission - to alleviate pain, restore health, and extend life - unites a global team of 90,000+ passionate people.
We are engineers at heart- putting ambitious ideas to work to generate real solutions for real people. From the R&D lab, to the factory floor, to the conference room, every one of us experiments, creates, builds, improves and solves. We have the talent, diverse perspectives, and guts to engineer the extraordinary.

Learn more about our business, mission, and our commitment to diversity here .

It is the policy of Medtronic to provide equal employment opportunity (EEO) to all persons regardless of age, color, national origin, citizenship status, physical or mental disability, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, genetic information, marital status, status with regard to public assistance, veteran status, or any other characteristic protected by federal, state or local law. In addition, Medtronic will provide reasonable accommodations for qualified individuals with disabilities.

At Medtronic, most positions are posted on our career site for 3-7 days.