As part of the client's failure analysis group, you are going to help craft solutions to complex problems. You'll collaborate with various teams to transform hardware components into an integrated reliable product by pushing the boundaries on what we can do in the realm of hardware technologies. You will function as a liaison between different groups, develop an understanding in materials by correlating its properties to performance and failures, address failure mechanisms and suggest possible solutions. You will also be expected to get trained on different tools, support material durability studies, develop standard operating protocols, and coordinate the use of instruments. We emphasize on a collaborative and interdisciplinary approach to solve technical issues and looking for an excellent team player.
Key Qualifications • Technical engineering degree in a related field. A person with a bachelor's degree in physical science is preferred. • Familiarity in detecting failures in consumer electronics. • At least 2+ years of hands-on experience in imaging techniques. • Proficient with 2D X-ray, x-ray tomography, and optical microscopy. • Experience in sample preparation required for different techniques. • Excellent written and oral communication and presentation skills and ability to build relationships. • Capable of collecting quality data, a basic understanding to cross-correlate results from different techniques, and present interpretations focused on the outstanding issue.
Description • Use different imaging techniques to drive root-cause analysis. • Get trained and support others to address needs from failure analysis projects • Interface with cross-functional teams • Adhere to the best-of-class lab practices. Maintain an organized and c laboratory environment, manage sample inventory, and follow all lab health and safety regulations