We are an established semiconductor company focused in design and manufacturing cutting edge diodes and lasers. We are looking for an electro-optical mechanical packaging engineer to join our team and focus on packaging from die bond stage through the final package which includes 14-pin and photonic integrated circuits. This role will oversee aspects of bonding, modeling, reporting and aspects of opto-mechanical packaging with Gan Diode Lasers. This is an excited role for someone to be based Nashua and grow within an establsihed publicly traded semiconductor company.
Key Responsibilities
Create die bonding statistical process controls and performance improvement strategies
Develop CoS bonding efforts and soldering solutions
Maintain FAC and SAC lens placement and fiber coupling effort
Support teams in burn-in criteria, HAST, HALT and qualification processes
Analyze laser device performance throughout package development and reliability testing
Benefits
Medical
Dental
Vision
PTO
Company Stock
Email Your Resume In Word To Looking forward to receiving your resume through our website and going over the position with you. Clicking apply is the best way to apply, but you may also:
katherine.tempel@cybercoders.com
Please do NOT change the email subject line in any way. You must keep the JobID: linkedin : KT4-1816769 -- in the email subject line for your application to be considered.***
Katherine Tempel - Recruiting Manager
Applicants must be authorized to work in the U.S.
This job was first posted by CyberCoders on 08/23/2024 and applications will be accepted on an ongoing basis until the position is filled or closed.
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