BSEE with 5+ years of experience or equivalent degree of Engineering or physics and a proven track record in performing failure analysis of IC devices and module level FA.
Hands on proficiency with Physical and Electrical Failure Analysis at Silicon level.
In-depth knowledge and proficiency with board level FA.
Hands on experience with EFA tools such as LIT, TDR, FIB, SEM, RIE, CMP, MIP, and decapsulation, sample preparation and Emission microscopy, Laser scan microscopy, micro-probing and Nano-probing.
Preferred Skills and Qualifications
Hand on experience in failure analysis in multiple tools and techniques. .
Strong technical writing and verbal communication skills
Excellent analytical skills and problem-solving ability.