Advanced Liquid Cooling Technologies Inc. (ALCT), an affiliate of the Airsys group, is at the
forefront of innovation with its cutting-edge liquid cooling technology. This technology efficiently cools electronics without the use of fans, utilizing 3D-printed, customizable devices tailored to each Original Equipment Manufacturer's semiconductors. This breakthrough enables new design possibilities without the constraints of traditional cooling technologies. Additionally, the waste heat from electronics can be captured and reused for heating water or interior spaces.
ALCT's heat sink devices have significant potential applications across cloud service providers, data center operators, crypto miners, equipment and boiler OEMs, and energy service providers. As the world moves towards net-zero and carbon-neutral initiatives, this technology is poised for substantial commercial impact in the coming decades.
Job Summary:
ALCT is seeking a passionate Thermal Application/Project Engineer to lead the cluster-level
architecture, design, analysis, and validation of liquid cooling technologies for HPC customer needs. This role emphasizes a design process based on estimating, simulating, and testing the thermal performance of new products and architectures. The ideal candidate will possess a strong background in heat transfer, fluid dynamics, and implementing thermal solutions in enterprise electronics
Responsibilities:
Develop and validate thermal/liquid cooling solutions for HPC cluster platforms in accordance with industry standards and customer specifications.
Evaluate system layout, power consumption, TCO, PID, BOM, acoustics, sensors, and related mechanical testing.
Perform cluster-level thermal analysis, definition, and testing, including chamber test setup, thermocouple installation, and automated data acquisition.
Conduct thermal debugging, system optimization, and documentation.
Oversee the development, design, documentation, and deployment of cluster-level liquid cooling customer projects.
Handle additional responsibilities such as rack integration, documentation, facilities preparation, on-site service, and support for PM/Sales/Field Application Engineers on customer projects.
Collaborate with cross-functional product development teams and international partners to meet reliability, power efficiency, system performance, and cost requirements.
Qualifications:
Bachelor's degree in Aerospace, Thermal, or Mechanical Engineering
Experience with server/PC products focusing on mechanical or thermal functions is preferred.
Proficient knowledge in thermal management hardware, heat transfer materials, heat exchangers, pumps, and cooling devices at a rack/cluster level.
Strong skills in mechanical/thermal engineering analysis, validation, documentation, and communication.
Familiarity with both mechanical/thermal and electrical/power aspects, including power distribution, AC power types, power calculations, DC power, and regulatory/safety considerations, is a plus.
Experience with server/rack liquid cooling solutions, including DCL (direct chip liquid cooling), rear door liquid cooling, liquid immersion cooling, and chilled water piping, is advantageous.
Must demonstrate a strong work ethic, the ability to thrive in a team environment, and adapt to a fast-paced setting.
Excellent organizational and problem-solving skills.
Effective communication skills, both verbal and written.
Willingness to travel for on-site customer deployments