Established in 2003, Hisense Broadband is a leading global provider of optical chips, optical modules and terminal equipment. At present, the company more than 4000 employees worldwide.
Key Responsibilities:
1. Undertake the development of high-end laser chip products to enhance the competitiveness of laser chips.
2. Improve the capabilities of the laser chip design and manufacturing platform: enhance the basic process capabilities of the process platform and expand integrated processes.
3. Explore new fields of optical chips.
Qualifications:
Doctoral degree or above
More than 10 years of experience in photonics chip research and development?
Possessing the full set capability required for developing of Photonics integrated circuits: design, process, characterization, and reliability.