On-Site at AmTECH Microelectronics, Morgan Hill, CA
Process Development Engineer
Are you passionate about driving innovation in the semiconductor industry and have an interest in microelectronics assembly and packaging? Do you enjoy working with cutting-edge technology and bringing innovative ideas to life? If so, we have an exciting opportunity for you!
About the role
In this position, you will be responsible for developing microelectronics assembly and packaging process flows for the manufacturing floor. This will involve knowledge of a variety of automated state-of-the-art manufacturing equipment and tools; as well as some experience working with different types of materials, like epoxies and solders. The assembly processes used at AmTECH include, flip chip bonding, die bonding, wire bonding, vacuum reflow, and encapsulation of chips or other semiconductor components to substrates or packages. As a process development engineer, you will play a key role in defining the manufacturing process and ensuring best manufacturing practices are followed on the production floor. You will be responsible for leading technicians, operators, and assemblers in the manufacturing floor to ensure they are following defined or outlined assembly processes. In addition, you will also be one of the main channels of communication between the production floor and customers when technical expertise is required.
Responsibilities • Program equipment and define process flows with the assistance of quality. • Address risk and mitigate any negative externalities that can occur on production floor. • Define best manufacturing processes for prototype and pre-production of customer's new product introduction (NPI), and create manufacturing process instructions (MPI). • Collaborate with product design engineers early in the design process to optimize a product for design for manufacturing (DFM). • Define and design tooling and fixture requirements for automated assembly machines to enhance efficiency. • Perform prototype test runs, evaluate the data collected, and communicate findings to support enhancements in manufacturing processes.
Requirements • Bachelor's or Master's degree in Mechanical Engineering, Electrical Engineering, Mechatronics, Material Science or other STEM degrees. • A minimum of 3 years of professional experience in semiconductor manufacturing environment. • Experience working with semiconductor materials (Si, Ge, GaAs, SiC, InP, GaN); and organic and ceramic substrates is a plus. • A "hands-on", practical, and pragmatic approach to problem-solving. • Excellent organizational abilities paired with a talent for accurate reporting and thorough documentation. • Familiarity with applying Six Sigma methodologies for process development and improvement.
What we offer • A role at the forefront of technology, working with cutting-edge microelectronics assembly processes and state-of-the-art equipment. • The opportunity to collaborate with a highly skilled and motivated team, driving innovation in the field of microelectronics assembly and packaging. • A challenging position offering room for personal initiative, growth, and professional development.
Benefits • Medical Insurance. • Dental Insurance. • Paid Time Off. • Paid Holidays. • 401K