We are hiring a Failure Analysis technician to investigate electrical and thermal mechanical package failures and support root cause analysis for new packaging technologies.
Qualifications:
Associate degree in science or engineering.
2-4 years of experience in failure analysis, material analysis, process development, or analytical tool development.
Knowledge of packaging materials and their behavior is a plus.
Strong communication, teamwork, and organizational skills.
Preferred Skills:
Hands-on experience with cross-sectioning, planar polishing, optical microscopy, and SEM imaging on PCBs.
About US Tech Solutions:
US Tech Solutions (www.ustechsolutions.com) is global firm providing a wide-range of talent on-demand and total workforce solutions. We are an Equal Opportunity Employer and Prohibit Discrimination and Harassment of Any Kind.