About the company: They are a global leader in wireless technology, driving innovation and shaping the future of connectivity. They offer cutting-edge solutions power the majority of 4G and 5G devices. They are committed to fostering a culture of collaboration, innovation, and excellence.
What we are seeking for the Vice President of Engineering - RF IC: We are seeking a dynamic Vice President of RF IC Engineering to lead RF Integrated Circuit Engineering team. This role will drive the development of advanced RF IC solutions, supporting our strategic goals and maintaining market leadership.
Key Responsibilities for the Vice President of Engineering - RF IC:
Lead and manage a team of hundreds of engineers.
Develop and implement strategic plans for RF IC design and development.
Oversee the design, development, and testing of RF ICs, ensuring high performance and reliability.
Collaborate with cross-functional teams to deliver innovative RF solutions.
Drive continuous improvement in engineering processes.
Mentor and develop engineering talent.
Manage a substantial P&L budget, covering R&D, engineering resources, and operational expenses.
Stay abreast of industry trends and advancements in RF technology.
Specific Projects:
Development of next-generation 5G RF transceivers.
Design and implementation of advanced CMOS RF ICs for IoT applications.
Integration of RF front-end modules for high-performance mobile devices.
Qualifications for the Vice President of Engineering - RF IC:
Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field; advanced degree preferred.
15+ years of experience in RF IC design and development.
Strong technical expertise in RF IC design, including CMOS, BiCMOS, and GaAs technologies.
Excellent leadership and management skills.
Strong problem-solving skills and strategic thinking.