We are seeking a highly skilled Optomechanical Packaging & Manufacturing Engineer to lead the development and optimization of packaging solutions for optoelectronic devices. This role focuses on process improvement, material selection, design for manufacturability, and cost-effective, high-yield production. You will collaborate with cross-functional teams, ensuring product reliability, compliance, and scalability.
Key Responsibilities:
Develop and optimize packaging solutions for photodiode devices across various market segments.
Drive NPI processes, ensuring designs meet internal and customer specifications.
Establish baseline process capabilities, implementing improvements for yield and efficiency.
Lead material selection, design verification, and process qualification for advanced packaging.
Conduct Design of Experiments (DOE) and statistical analysis for process optimization.
Ensure compliance with ISO9001 standards and support audits.
Collaborate with quality, supply chain, and manufacturing teams to streamline operations.
Provide technical leadership to enhance next-gen fabrication and assembly capabilities.
Qualifications:
BS/MS in Mechanical Engineering, Material Science, or related field.
8+ years of experience in optoelectronic packaging, semiconductor, or photonics manufacturing.
Expertise in manufacturing processes, material properties, and packaging techniques.
Strong background in Six Sigma, DOE, and root cause analysis.
Experience in FEA-based analysis for photonics packaging is a plus.