Sr. IC Packaging Project Manager - Flip Chip at Kforce Inc in Phoenix, Arizona

Job Description:

RESPONSIBILITIES:

Kforce's client, a growing engineering technology company in the Chandler, AZ area is seeking a Senior Electronics Packaging Engineer/Project Manager (Flip Chip). We are working directly with the hiring authority. This company offers a competitive base salary and annual bonus. Candidates must reside in the Phoenix, AZ metro area and/or be able to relocate to the Phoenix, AZ area. Our client will provide a relocation package. This position is hybrid remote. (2 days from home and 3 days in office).

Responsibilities:

• Partner with teams to achieve annual goals, while managing customer relationships to grow market share


• Provide program management and internal process development in support of customers, offshore factories and supplier development teams while supporting qualification and mass production of flip chip products


• Promote company technologies directly to new and existing customers to find potential applications, deploying the flip chip package portfolio with key customers


• Work closely with customer teams to understand the assembly, reliability and scheduling requirements for various new package configurations and product introductions; To include: substrate design, silicon to package interconnects, product assembly material selections, etc.


• Create detailed package/process risk assessments for the manufacturability and reliability of NPIs, including highlighting areas of customer requirements that drive cost and implementing mitigation plans


• Work closely with customer package engineering and Company factory engineering to understand/characterize prototype build plans; Enabling successful qualifications and on-time manufacturing production ramps


• Assist the team in designing experiments, analyzing factory build data, root cause failure analysis investigation, and corrective action pathways to resolution

REQUIREMENTS:

• BS degree in Engineering such as Mechanical, Chemical, Electrical, Industrial, Materials Science or similar field


• 6-8+ years of demonstrated industry experience required, with semiconductor packaging experience required


• Familiarity with Design of Experiments (DoE) and Statistical Process Control (SPC) is needed


• Previous project management experience is a required


• Knowledge of material and package characterization data analysis, test methods and qualification procedures are required


• Strong understanding of wafer bump, assembly processes and techniques


• Proven ability to multiplex across numerous programs and teams is essential; Experience working with offshore factories is a plus


• Demonstrated self-drive and motivation to adapt and overcome obstacles across a multi-faceted, dynamic, and fast-paced environment; Ability to work independently in a heavily matrixed organization


• Requires excellent, demonstrated written and verbal communication skills


• Proficiency with Microsoft Office (Excel, PowerPoint, Outlook) is required


• This position can require up to 10% travel

Nice to haves:

• Experience with cost modeling, pricing, quoting activities and products is very beneficial


• Flip Chip package design and OSAT experience will be a plus


• Experience working with external customers is highly preferred

The pay range is the lowest to highest compensation we reasonably in good faith believe we would pay at posting for this role. We may ultimately pay more or less than this range. Employee pay is based on factors like relevant education, qualifications, certifications, experience, skills, seniority, location, performance, union contract and business needs. This range may be modified in the future.

We offer comprehensive benefits including medical/dental/vision insurance, HSA, FSA, 401(k), and life, disability & ADD insurance to eligible employees. Salaried personnel receive paid time off. Hourly employees are not eligible for paid time off unless required by law. Hourly employees on a Service Contract Act project are eligible for paid sick leave.

Note: Pay is not considered compensation until it is earned, vested and determinable. The amount and availability of any compensation remains in Kforce's sole discretion unless
and until paid and may be modified in its discretion consistent with the law.

This job is not eligible for bonuses, incentives or commissions.

Kforce is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status.

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