Process Development Engineer at Samtec, Inc. in Colorado Springs, Colorado

Job Description:

Samtec, Inc.

Founded in 1976, Samtec is a privately held, $1 Billion global manufacturer of a broad line of electronic interconnect solutions, including High-Speed Board-to-Board, High-Speed Cables, Mid-Board and Panel Optics, Precision RF, Flexible Stacking, and Micro/Rugged components and cables. Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system from the bare die to an interface 100 meters away, and all interconnect points in between. With 40+ international locations and products sold in more than 125 different countries, Samtecs global presence enables its unmatched customer service.

Samtec is seeking a Process Development Engineer for the Colorado Springs, CO location. The salary range for this position is $100,000 - $130,000 per year inclusive of applicable bonus and commensurate with experience. Standard benefit offerings available are medical (HSA/PPO), dental, vision, group life, AD&D, short and long term disability, EAP, 401k plus other voluntary options as well as time off.

Summary/Objective: The process development engineer works with internal design teams and other engineers to build prototypes, develop processes and integrate processes for new products. Developing products for manufacturability is critical whether it involves feedback to design on manufacturability constraints and risks or making sure hardware, documentation, and processes are ready to hand over to production. The Samtec Optics division is constantly developing new products in the optoelectronic industry and the Microelectronics Process Engineering team is critical to bringing those products physically to market. Key process areas include die attach (epoxy attach, thermocompression bonding, thermosonic bonding), wire bonding, dicing, epoxy dispensing, metrology, and defect inspection. Essential Functions/Responsibilities:

1. Assembly Engineering support to review Customer requirements and determine the correct processes, materials, hardware and time frame needed to meet build requirements.
2. Interaction as required with both internal and external customers regarding product specification reviews and technical issues.
3. Responsible for conducting thorough Design of Experiments on new Assembly Processes with the goal of developing new process technology and improving early product life cycle assembly yield
4. Collect and analyze process development data and information to determine next steps in process and product qualification cycles.
5. Generate detailed reports and specifications documenting all experimental and process findings and procedures. Provide DOE, SPC, and yield reporting in a clear and presentable format.
6. Evaluate and provide recommendations on new equipment to support continuous technology improvements to meet future customer requirements.
7. Responsible for programming and assembling parts through product development cycles for both automated and non-automated processes, particularly in the die attach, wire bonding and epoxy dispensing process areas. Documents processes and procedures accordingly.
8. Participates and drives FMEA and PFMEAs where applicable.
9. Must be able to work independently and interact with colleagues, customers and vendors as necessary to achieve program objectives.
10. Work in a manufacturing environment where prioritization amongst production and development work must be balanced and feedback loops between production and development engineers must be continuous.

The responsibilities as defined are intended to serve as a general guideline for this position. Associates may be asked to perform additional tasks depending on strengths and capabilities. Required Experience:

1. 7+ years of semiconductor, optoelectronics or microelectronics packaging process and equipment engineering experience. Die bonding experience is strongly preferred
2. Materials used for standard package technology, PCBA, Optoelectronics, and assorted substrates.
3. Demonstrated experience in assembly process development.
4. Ability to meet International Traffic in Arms Regulations (ITAR) compliance requirements
5. Hands-onexperience of the equipment and materials that are used in the industry.
6. Hands-onexperience operating equipment to perform a specific process.
7. Demonstrated experience in problem-solving and root cause analysis.
8. MS Office Excel, Powerpoint, Word and Sharepoint proficiency is required
9. Experience in DOE and data analysis software, like JMP, is preferred.
10. Experience in microelectronic / microsystem package design and SolidWorks, AutoCAD, or other engineering design, modeling or simulation software is desirable.
11. Excellent written and verbal communication skills with ability to frame the topic for easy understanding, propose constructive ideas, and communicate can do attitude.
12. Must be a self-starter with strong leadership skills.
13. Excellent interpersonal skills in relating to positively engage with both internal and external customers.
14. Personal flexibility is necessary to ensure efficient execution of the plan and teamwork.

Preferred Education:

1. Bachelors Degree in Engineering (Mechanical, Electrical, Chemical, Material Science) or equivalent is required.

SAMTEC, Inc. is an Equal Opportunity Employer and committed to creating a diverse environment. All employment decisions at Samtec are based on business needs, job requirements and individual qualifications, without regard to race, color, religion or belief, national, social or ethnic origin, pregnancy or parental status, age, disability, sexual orientation, gender and/or gender identity/expression, marital status, past or present military service, family medical history or genetic information, or any other status protected by applicable laws.

PI254133500

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