Under the direction of the Manager of Wafer Characterization, the FIB/SEM Engineer performs physical characterizations and materials/failure analyses of product devices using state-of-the-art analytical FIB/SEMs, prepares sophisticated TEM lamella samples, analyzes results, summarizes findings, and supports the development of new designs, processes, or materials for magnetic recording heads, MRAM, or other devices. This position is in Milpitas, California.
ESSENTIAL FUNCTIONS:
Prepares sophisticated TEM lamella samples using different FIB/SEMs to support TEM analyses
Performs device cross-section imaging and metrology through high-resolution SEM/STEM imaging
Performs materials/failure analysis using different advanced analytical FIB/SEMs attached with EDS, EBSD and ToF-SIMS
Performs device structure analysis and failure analysis using FIB/SEM 3D tomography
Actively participate in developing new recipes to improve the consistency and efficiency of sample preparation.
Works with other team mates on developing new techniques for sophisticated metrology and device/material failure analysis
Proactively responds to issues related to materials quality or the characterization process and initiates resolution
Reviews and analyzes data, creates reports, and presents findings to panels, groups, teams, or departments as required
Interacts and responds to inquiries from other product groups regarding process-related issues and product or device requirements
Adheres to all safety policies and procedures as required
Performs other duties of a similar nature or level*
MINIMUM QUALIFICATIONS:
Master's or PhD degree in Materials Science, Chemical Engineering, or Physics or a Bachelor's degree and three years of equivalent experience
Significant hands-on experience in TEM lamella sample preparation and in-depth understanding of FIB/SEM instrument fundamentals
Strong interest in metrological, materials and failure analyses for the advancement of magnetic recording technology using knowledge and skills of different materials analysis techniques.
Proficient in the use of Microsoft Office Applications
Knowledge, Skills, and Abilities:
Proficient in the fundamental understandings of FIB/SEM, EDS, EBSD, 3D tomography
Knowledge and ability to prepare TEM lamella samples, design and conduct experiments, interpret complex data, and recommend correction action
Good fundamental understanding or hands-on experience in TEM, STEM, EDS, EELS
Knowledge of semiconductor or basic HDD industry principles, practices, and techniques
Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations
Able to independently create reports, presentations, and written analysis summaries
Strong ability to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management
Demonstrated ability to understand and carryout complex instructions given verbally or in writing
Able to work productively and collaboratively with all levels of employees and management
Able to comply with all safety policies and procedures
Demonstrated organizational and time management skills
Demonstrated problem-solving and trouble shooting skills
Flexible and able to prioritize
The annual base salary for this full-time position is between $96,655.00-$142,140.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically.
WORKING CONDITIONS:
The FIB/SEM Engineer will work primarily in a quiet and clean laboratory environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. Frequently works in a laboratory environment; wears a lab coat, gloves, and other safety equipment; spends a majority of time in a seated position, but occasionally stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May occasionally be required to push, pull, or lift up to 10 pounds.
*Other duties of a similar nature or level are duties that may be required, but may not be specifically listed in the job description or posting.
TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.