Engineer III, Senior or Lead - Packaging Process Integration
About Thintronics
More Data. Faster.
Global data volume traffic has been growing exponentially. The onset of AI applications is expected to make this worse. New insulator technology that enables higher frequency data transmission at lower power consumption is required to scale AI infrastructure, starting with the data center fabric. By synthesizing expertise in bottom-up Molecular Design, Computational Mechanics, and Electrical Engineering, Thintronics is unifying and optimizing the high-speed interconnect insulator, from silicon-to-system, enabling the highest data rates at the lowest power.
Thintronics is a start-up company located in Alameda, CA. We are a team of chemists, materials scientists, and engineers shaping the future of data and devices. We offer an exciting start-up environment at the interface of R&D, machine learning-aided product design, manufacturing, and rapid market implementation.
Job Description
We are looking for a talented Packaging Process Integration Engineer to support Thintronics' adoption into advanced semiconductor applications. This is a high-visibility/high-impact role with leadership growth potential.
The position responsibilities include:
1) NPI and Processing Guidelines Development
Work with OSAT and substrate manufacturers to develop and refine manufacturing guidelines
Create DFM/DFA reports (Design for Manufacturability/Assembly)
Establish Design of Experiments for yield optimization and high-volume manufacturing
Synthesize experimental data and generate design rules to be shared with design teams
2) Novel Packaging Integration Schemes
Develop future product roadmaps that leverage Thintronics' technology
Develop integration schemes for 2.5/3D, interposer, chiplet, and system-in-package (SiP)
3) Additional responsibilities may include:
Support company growth by mentoring junior engineers and scientists
Build and maintain internal relationships with the R&D team
Communicate Thintronics' achievements and product roadmap to a larger audience through Trade Shows and Business Development events
Who We Want:
We are seeking entrepreneurial people because here - your impact matters. We want individuals who aren't afraid of hard work and new challenges; possess a "can-do" attitude; can work independently as well as collaboratively; and have the drive to excel.
Minimum Qualifications:
M.S. or Ph.D. in Material Science, Mechanical Engineering, Electrical Engineering, or Chemistry with emphasis on packaging or PCB design and manufacturing.
5+ years of experience in semiconductor packaging design or manufacturing.