Job Description:
DUTIES/RESPONSIBILITIES:
- Lead and manage the plating process and technology, overseeing operation and ensuring the successful execution of projects and tasks.
- Develop and implement strategies to optimize plating processes, improve efficiency, and meet production targets.
- Collaborate with other technical leaders to support new product development and process improvements.
- Provide technical guidance and mentorship to engineers, operators, and other team members.
- Oversee equipment maintenance, calibration, and upgrades to ensure optimal performance.
- Develop and maintain documentation including standard operating procedures (SOPS), work instructions, and process specifications.
- Monitor and analyze KPIs to track progress, identify areas for improvement, and drive corrective actions.
- Stay updated on industry trends, emerging technologies, and best practices in plating and substrate manufacturing.
REQUIREMENTS:
- Proven track record of leadership and management in a substrate for semiconductor manufacturing.
- Strong technical expertise in plating equipment, processes, and chemical materials.
- Excellent problem-solving skill and ability to make data-driven decisions.
QUALITIFICATIONS:
- In-depth technical knowledge of relevant process and industry
- Effective communication skills and ability to collaborate with colleagues.
- Must be at least 18 years old and authorized to work in the United States
EDUCATION:• Bachelor's or master's degree in engineering or science related to chemistry
EXPERIENCE: • 5+ year of Engineering experience in the substrate for semiconductor with a focus on plating processes or materials